2020 - Volume 16 [Issue 3]


Short Research Article


Original Research Article

Semiconductor Package Design Solution for Addressing High-Density Configuration

Rennier Rodriguez, Frederick Ray Gomez, Maiden Grace Maming

DOI: 10.9734/jerr/2020/v16i317166

Page: 1-6

Resolution of Damaged Metallization on Highly Complex Semiconductor Device

Antonio Sumagpang Jr., Frederick Ray Gomez

DOI: 10.9734/jerr/2020/v16i317167

Page: 7-12

A Study of Die Shear Test Performance on Different Diebond Machine Platforms

B. C. Bacquian, R. Rodriguez, N. Gomez, E. Graycochea Jr., F. R. Gomez

DOI: 10.9734/jerr/2020/v16i317169

Page: 19-23


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