2020 - Volume 10 [Issue 2]


Case study


Original Research Article

Modified Sidewall Design of QFN Package

Frederick Ray I. Gomez, Rennier S. Rodriguez

DOI: 10.9734/jerr/2020/v10i217033

Page: 19-23

Warpage Mitigation through Diebond Process Improvement with Enhanced Leadframe Configuration

Edwin M. Graycochea Jr., Frederick Ray I. Gomez, Rennier S. Rodriguez

DOI: 10.9734/jerr/2020/v10i217035

Page: 39-42

Optimization of Mild Steel Welding Process Parameters Using Multivariate Linear Regression

William E. Odinikuku, David Atadious, Ikechukwu P. Onwuamaeze

DOI: 10.9734/jerr/2020/v10i217036

Page: 43-50

A Comprehensive Study for Specialized Silicon-on-Insulator Wafers

Bryan Christian S. Bacquian, Frederick Ray I. Gomez

DOI: 10.9734/jerr/2020/v10i217037

Page: 51-57


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