2018 - Volume 3 [Issue 2]


Original Research Article

Challenges and Resolution for Copper Wirebonding on Tapeless Leadframe Chip-on-Lead Technology

Antonio R. Sumagpang Jr, Frederick Ray I. Gomez

DOI: 10.9734/jerr/2018/v3i216869

Page: 1-13

A Computerized Boundary Element Algorithm for Modeling and Optimization of Complex Magneto-Thermoelastic Problems in MFGA Structures

Mohamed Abdelsabour Fahmy, Saleh M. Al-Harbi, Badr Hamedy Al-Harbi, Alanod M. Sibih

DOI: 10.9734/jerr/2018/v3i216872

Page: 1-13

Development of a Preconditioning System for FUTA Floating Fish Feed Extruder

A. P. Olalusi, C. F. Nwaeche, A. Adesina

DOI: 10.9734/jerr/2018/v3i216873

Page: 1-10


Review Article


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