A Robust Approach of Maintaining Epoxy Position on Die Attach Process of Tapeless QFN Packages
Jerome J. Dinglasan *
STMicroelectronics, Inc., Calamba City, Laguna, 4027, Philippines.
Leandro D. Saria
STMicroelectronics, Inc., Calamba City, Laguna, 4027, Philippines.
Frederick Ray I. Gomez
STMicroelectronics, Inc., Calamba City, Laguna, 4027, Philippines.
*Author to whom correspondence should be addressed.
Abstract
Epoxy quality contributes a great role in defining quality products of quad flat no lead multi row packages. In dealing with certain problems related to epoxy position shift caused by unoptimized design, innovation on the dispenser module is considered and focused at. This paper discusses the phenomenal issue of epoxy position shifting in die attach process and the solutions applied. The current design of dispenser module in die attach machine demonstrates flaws that need to be improved through design optimization. Innovative approach was applied, removing variables on the design that caused rejections during die attachment due to the shifted epoxy position. The improved design was able to address the issue as projected on the study, and helps not only the epoxy position performance, but also the set-up time of epoxy during syringe replacement. This design can be adapted by other manufacturing for process improvement and robustness.
Keywords: Die attach process, epoxy dispense module, epoxy position, QFN multirow.