2021 - Volume 20 [Issue 3]

Case study

Evaluation of the Practice of Building Survey for Maintenance of Public Building in South-East Nigeria

Osuagwu Andrew Chima, Nkeleme Emmanuel Ifeanyichukwu, Amafili Tochukwu Nnamdi, Ike Goodluck Chukwuemeka, Nzeneri Oluchukwu Precious-favour

DOI: 10.9734/jerr/2021/v20i317288
Published: 15 March 2021
Page: 108-122

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Short Research Article

Modeling of Leadframe Strip Warpage after Die Attach Cure Process

Jefferson Talledo

DOI: 10.9734/jerr/2021/v20i317281
Published: 9 March 2021
Page: 50-56

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Original Research Article

Augmented Leadframe Design for Stable Multi-Wire Ground Bonding

Frederick Ray I. Gomez, Alyssa Grace S. Gablan, Anthony R. Moreno, Nerie R. Gomez

DOI: 10.9734/jerr/2021/v20i317273
Published: 20 February 2021
Page: 1-5

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Understanding Package Crack Signatures in a Leadframe Semiconductor Package

Jefferson Talledo

DOI: 10.9734/jerr/2021/v20i317274
Published: 20 February 2021
Page: 6-14

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Glue Voids Reduction on QFN Device through Material and Process Improvement

Edwin M. Graycochea Jr., Endalicio D. Manalo, Rennier S. Rodriguez, Frederick Ray I. Gomez

DOI: 10.9734/jerr/2021/v20i317275
Published: 25 February 2021
Page: 15-19

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Mathematical Skills and the Academic Performance of Junior and Senior Electrical Engineering Students of the University of Eastern Philippines

Kenneth Bryan F. Abaigar, Benjamin D. Varela

DOI: 10.9734/jerr/2021/v20i317276
Published: 25 February 2021
Page: 20-31

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Die Crack Resolution through Pick-up Process Optimization for BGA Package

R. Rodriguez, E. Graycochea Jr., F. R. Gomez, E. Manalo

DOI: 10.9734/jerr/2021/v20i317277
Published: 25 February 2021
Page: 32-36

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Modeling Study on the Solder Joint Reliability of a Leadframe Package under Powered Thermal Cycling

Jefferson Talledo

DOI: 10.9734/jerr/2021/v20i317279
Published: 26 February 2021
Page: 37-43

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Establishing Robust Control for Epoxy Open Time

Michael D. Capili

DOI: 10.9734/jerr/2021/v20i317280
Published: 9 March 2021
Page: 44-49

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Enhanced Wirebonding Technique on QFN Device with Critical Die Reference

Jonathan C. Pulido, Frederick Ray I. Gomez

DOI: 10.9734/jerr/2021/v20i317283
Published: 11 March 2021
Page: 57-61

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Response Surface Optimization of Corn Husk Fiber Mercerization Using NaOH

Julius Mmelikam Chukwuemeka, Joseph Tagbo Nwabanne, Victor Ifeanyi Ugonabo

DOI: 10.9734/jerr/2021/v20i317284
Published: 11 March 2021
Page: 62-82

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Investigation on Die Crack in a Stacked Die Package Using Finite Element Analysis

Jefferson Talledo

DOI: 10.9734/jerr/2021/v20i317285
Published: 11 March 2021
Page: 83-91

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Enhanced Die Attach Process Defect Recognition on QFN Leadframe Packages

Marque Ryan Salcedo, Alyssa Grace Gablan, Jerome Dinglasan, Frederick Ray Gomez

DOI: 10.9734/jerr/2021/v20i317286
Published: 13 March 2021
Page: 92-96

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Automotive Package Lead Pullback Elimination Using Monte Carlo Analysis for Determining Leadframe and Blade Design

Jefferson S. Talledo, Patricio A. Cabading Jr., Rogelio A. Real

DOI: 10.9734/jerr/2021/v20i317287
Published: 15 March 2021
Page: 97-107

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Increasing Singulation Machine UPH through Characterization and Standardization of Saw and Handler Parameters through DMAIC Methodology

Lloyd L. Rolluqui, Patricio A. Cabading Jr, Jimmy P. Domingo

DOI: 10.9734/jerr/2021/v20i317289
Published: 17 March 2021
Page: 123-140

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