Open Access Short Research Article

Predicting Silicon Die Breaking Force in Semiconductor Package Assembly through Mechanical Simulation

Jefferson Talledo

Journal of Engineering Research and Reports, Page 17-25
DOI: 10.9734/jerr/2021/v20i517307

Die crack is a common problem in the semiconductor industry and being able to predict the breaking force at a given loading condition could help prevent such crack problem. This paper presents the use of mechanical simulation in predicting the force at which the silicon die breaks in semiconductor package assembly process. A computer simulation with finite element analysis (FEA) technique was used. The applied force or displacement in a die bending simulation with 3 mm, 4 mm and 15 mm support span was varied until the resulting maximum principal stress of the die becomes equal to its fracture strength. Results revealed that the breaking force for the 70 µm die with 6 mm width is around 5 N for the 3 mm support span and only around 1 N for the 15 mm support span. With the good agreement between modeling and actual results, the study showed that mechanical simulation is an effective approach in predicting die breaking force and can be used to simulate different mechanical loads in the package assembly where possible die crack could happen and be avoided. This is a fast and cost-effective way of assessing risk of die crack and obtaining package assembly process parameters and specifications that are safe to the silicon die.

Open Access Original Research Article

Indirect Material Cost Reduction by Eliminating Manual Derailing Process through Process Simplification

Christopher L. Dela Cruz, Patricio Cabading Jr., Melanie Paglicawan

Journal of Engineering Research and Reports, Page 1-12
DOI: 10.9734/jerr/2021/v20i517305

This paper will discuss how to reduce (IDM) Indirect Material consumption for derailing process by eliminating the manual derailing method as part of cost saving project. It involves the removal of cutter blade used for derail.Cost improvement was one of organizational goals of the company for 2019. This drive can be supported by analyzing Indirect Material spending and process simplification at assembly plant. At assembly End-Of-Line processes, derail cutter blade was one of the top Indirect Material spending at singulation and there is an opportunity to reduce if not eliminated the cost consumption of derail cutter blades through process simplification. Increasing volume in Quad-Flat-No lead (QFN) packages and new banner products being develop by New Product Integration NPI, Q1’20 means increase in IDM consumption per process. The challenge is to drive a process simplification that will reduce IDM to save cost by start of Q2’20. DMAIC methodology was used to improve the process of derailing process.

Open Access Original Research Article

Eliminating Frequent Machine Assists through Process Plate Enhancement on Wirebonding Process

Jonathan Pulido, Edwin Graycochea Jr., Frederick Ray Gomez

Journal of Engineering Research and Reports, Page 13-16
DOI: 10.9734/jerr/2021/v20i517306

New devices and technologies in the semiconductor industry are getting more challenging to process because of inherent issues especially on quad-flat no-leads (QFN) packaging assembly. This paper is focused on the improvement done for QFN leadframe device to address the major machine assist during the lot processing at wirebond process. Illumination and visual of the leadframe and the sand blasting process plate on the machine are difficult to separately distinguish due to similar color shade of the materials, thus frequent machine assists ensued. To reduce the frequent machine assist occurrence, an improvement is done through enhancing the process plate by using a black chrome to totally separate the illumination of leadframe and the process plate. Ultimately, the machine assist during wirebonding process is improved (the longer the better) from 16 minutes to 6 hours continuous and uninterrupted running.