A Case Study of Asset Integrity and Process Safety Management of Major Oil and Gas Companies in Malaysia

Kuok Ho Daniel Tang

Page: 6-19
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Fracture Strength Characterization of the Die Active Side and Back Side for a Realistic Die Crack Assessment

Jefferson Talledo

Page: 84-90
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Ball Crack Mitigation through Wirebond Process Optimization

Anthony R. Moreno, Frederick Ray I. Gomez, Rennier S. Rodriguez

Page: 1-5
Abstract View: 115 times | Full Article – PDF: 93 times | Review History: 0 times |

Mathematical Analysis of Uncertainty in Bangladesh Agricultural Sector

Mohammad Khairul Islam, Md. Mahmud Alam, Mohammed Forhad Uddin

Page: 20-31
Abstract View: 66 times | Full Article – PDF: 61 times | Review History: 0 times |

Reliability Evaluation of Rooftop Solar Photovoltaics Using Coherent Threshold Systems

Rudi Uswarman, Ali Muhammad Rushdi

Page: 32-44
Abstract View: 91 times | Full Article – PDF: 82 times | Review History: 0 times |

“Rey Resin Dispense Pattern” A Solution to Package Voids Defect on Thinner Package Thickness in Compression Mold

Lester Joseph T. Belalo, Rey Nino C. Arnido

Page: 45-58
Abstract View: 86 times | Full Article – PDF: 68 times | Review History: 0 times |

Variations of the Time to Failure (TTF) for Specific Components in Aeronautical Navigation Systems

Alaa Mohammad Alturki, Ali Muhammad Rushdi

Page: 59-68
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Expanded Usage Window of Molding Compound to Reduce Material Wastage in Manufacturing Line

Roland Soriano, Lester Joseph T. Belalo, Rey Nino C. Arnido

Page: 69-83
Abstract View: 58 times | Full Article – PDF: 48 times | Review History: 0 times |

Quantitative Analysis of Geomorphologic Characteristics for Surface Runoff Determination in Amala River Catchment in Kenya

Samuel M. Kinyanjui, Japheth O. Onyando, Raphael M. Wambua

Page: 91-106
Abstract View: 54 times | Full Article – PDF: 55 times | Review History: 0 times |

Mechanical Modeling Study on the Impact of Pick-and-Place Design on Die Attach Voids

Jefferson Talledo

Page: 107-112
Abstract View: 41 times | Full Article – PDF: 41 times | Review History: 0 times |

Die Placement Advancement for Prevention of Silhouetted Die Occurrence on LGA Package

Rennier Rodriguez, Frederick Ray Gomez, Edwin Graycochea Jr.

Page: 113-117
Abstract View: 51 times | Full Article – PDF: 37 times | Review History: 0 times |

Stress Modeling Study on Package Crack Due to Debris

Jefferson Talledo

Page: 118-124
Abstract View: 39 times | Full Article – PDF: 38 times | Review History: 0 times |

Capacity Improvement for Transfer Molding Trough Reduction of Mold Curing Time

Lester Joseph T. Belalo, Maiden Grace R. Maming

Page: 125-141
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Understanding Package Delamination through Package Deformation Modeling at Different Thermal Conditions

Jefferson Talledo

Page: 142-148
Abstract View: 13 times | Full Article – PDF: 9 times | Review History: 0 times |