Package Substrate Die Pad Roughening Innovative Solution to Strengthened Die Attach Adhesion

Michael D. Capili

Page: 33-40
Abstract View: 244 times | Full Article - PDF: 265 times | Review History: 0 times |

Semiconductor Package Design Solution for Addressing High-Density Configuration

Rennier Rodriguez, Frederick Ray Gomez, Maiden Grace Maming

Page: 1-6
Abstract View: 462 times | Full Article - PDF: 340 times | Review History: 0 times |

Resolution of Damaged Metallization on Highly Complex Semiconductor Device

Antonio Sumagpang Jr., Frederick Ray Gomez

Page: 7-12
Abstract View: 248 times | Full Article - PDF: 275 times | Review History: 0 times |

Evaluating the Challenges in Pressure – Volume – Temperature (PVT) Analysis of Gas Condensate Reservoirs

Aniedi B. Usungedo, Julius U. Akpabio

Page: 13-18
Abstract View: 276 times | Full Article - PDF: 293 times | Review History: 0 times |

A Study of Die Shear Test Performance on Different Diebond Machine Platforms

B. C. Bacquian, R. Rodriguez, N. Gomez, E. Graycochea Jr., F. R. Gomez

Page: 19-23
Abstract View: 280 times | Full Article - PDF: 259 times | Review History: 0 times |

Optimization of Proportional Integral Derivative Parameters of Brushless Direct Current Motor Using Genetic Algorithm

Isaiah Adebayo, David Aborisade, Olugbemi Adetayo

Page: 24-32
Abstract View: 266 times | Full Article - PDF: 305 times | Review History: 0 times |