Open Access Short Research Article

Package Substrate Die Pad Roughening Innovative Solution to Strengthened Die Attach Adhesion

Michael D. Capili

Journal of Engineering Research and Reports, Page 33-40
DOI: 10.9734/jerr/2020/v16i317171

Poor die adhesion to substrate resulting to stray dice issue for the MEMS package was encountered. This die bond failure mechanism has a downstream effect specifically on the mold process. The presence of the stray die resulted to mold compound leakage outside the tool cavity due to planarity not achieved. The mold compound that leaks affected the overall package thickness, thus exposing the wires.

Using the Design of Experiment methodology, the team generated different simulations and validations to resolve the stray die problem. Based on the simulation and experiments, it was established that an optimum substrate roughness is necessary to achieve a better adhesion between the Die adhesive and the substrate. 

This paper presents a systematic study on how the substrate roughness can improve the adhesion of Die Attach film (DAF) to the substrate thereby resolving the Stray Die problem.  Results showed that the die adhesion strength on the substrate increases as the substrate surface roughness increased from Ra 0.05 um to Ra 1.5 ~ 2.0 mm. Consequently, the rejection rate of stray dice was eliminated. This new learning will be used to establish a standard on surface roughness for substrate-based material that can be applied to new packages.

Open Access Original Research Article

Semiconductor Package Design Solution for Addressing High-Density Configuration

Rennier Rodriguez, Frederick Ray Gomez, Maiden Grace Maming

Journal of Engineering Research and Reports, Page 1-6
DOI: 10.9734/jerr/2020/v16i317166

The direction for integrated circuit (IC) packaging is getting smaller yet with increasing unit performance. In this case substrate-based technology became limited to miniaturization and downsizing direction. In this paper, a specialized design of IC is presented and discussed through augmentation of routing channels at the backside of the silicon die to eliminate the substrate application in the package. Routed channels are fabricated using plating or immersion process that are electrically connected to the bonding pads through conductive via within the silicon material. By eliminating the substrate re-distribution layers (RDL), a package is expected to decrease by 20 – 40% from its designed dimension.

Open Access Original Research Article

Resolution of Damaged Metallization on Highly Complex Semiconductor Device

Antonio Sumagpang Jr., Frederick Ray Gomez

Journal of Engineering Research and Reports, Page 7-12
DOI: 10.9734/jerr/2020/v16i317167

The paper focused on the resolution of damaged metallization during assembly process that lead to gross open-short (O/S) rejections during functional testing of a highly complex semiconductor package. Numerous batches were put on hold due to not meeting the specification assigned for the short contact test. Design of experiments (DOE) on assembly processes were conducted and eventually identified the reject as an electrostatic discharge (ESD) related failure. Corrective actions and ESD controls significantly reduced the occurrence of damaged metallization with around 85% reduction.

Open Access Original Research Article

Evaluating the Challenges in Pressure – Volume – Temperature (PVT) Analysis of Gas Condensate Reservoirs

Aniedi B. Usungedo, Julius U. Akpabio

Journal of Engineering Research and Reports, Page 13-18
DOI: 10.9734/jerr/2020/v16i317168

Aims: The variations in production performances of the Black oil and compositional simulation models can be evaluated by simulating oil formation volume factor (Bo), gas formation volume factor (Bg), gas-oil ratio (Rs) and volatilized oil-gas ratio (Rv). The accuracy of these two models could be assessed.

Methodology: To achieve this objective some basic parameters were keyed into matrix laboratory (MATLAB) using the symbolic mathematical toolbox to obtain accurate Pressure Volume Temperature (PVT) properties which were used in a production and systems analysis software to generate the production performance and hydrocarbon recovery estimation. Standard black oil PVT properties for a gas condensate reservoir was simulated by performing a series of flash calculations based on compositional modeling of the gas condensate fluid at the prescribed conditions through a constant volume depletion (CVD) path. These series of calculations will be carried out using the symbolic math toolbox. PVT property values obtained from both compositional modeling and black oil PVT prediction algorithm are incorporated to determine the production performance of each method for comparison.

Results: The absolute open flow for the black oil PVT algorithm and the compositional model for the Rs value of 500 SCF/STB and Rs value of 720SCF/STB were 130,461 stb/d and 146,028 stb/d respectively showing a 10.66% incremental flow rate.

Conclusion: In analyzing PVT properties for complex systems such as gas condensate reservoirs, the use of compositional modeling should be practiced. This will ensure accurate prediction of the reservoir fluid properties.

Open Access Original Research Article

A Study of Die Shear Test Performance on Different Diebond Machine Platforms

B. C. Bacquian, R. Rodriguez, N. Gomez, E. Graycochea Jr., F. R. Gomez

Journal of Engineering Research and Reports, Page 19-23
DOI: 10.9734/jerr/2020/v16i317169

The paper focused on the evaluation of quad-flat no-leads single-row (QFN-sr) leadframe package for die shear test performance on different diebond machine platforms. Die shear test determines the adhesion strength on the interface between the silicon die and the die attach glue to the diepad of the leadframe device. Moreover, the test is critically monitored as failed response may lead to die lift or delamination. Statistical results showed the two diebond machines achieving die shear test performance above the specification, with Machine Y having significant improvement over its counterpart. Future works could utilize any of the two diebond machines platforms as far as die shear test performance is concerned. For devices with critical requirement, Machine Y is recommended for its higher die shear test performance capability.

Open Access Original Research Article

Optimization of Proportional Integral Derivative Parameters of Brushless Direct Current Motor Using Genetic Algorithm

Isaiah Adebayo, David Aborisade, Olugbemi Adetayo

Journal of Engineering Research and Reports, Page 24-32
DOI: 10.9734/jerr/2020/v16i317170

Optimal performance of the Brushless Direct Current (BLDC) motor is to be realized using an efficient Proportional Integral Derivative (PID) controller. However, conventional tuning technique fails to perform satisfactorily under parameter variations, nonlinear conditions and time delay. Also using conventional technique to tune the parameters gain of the PID controller is a difficult task. To overcome these difficulties, modern heuristic optimization technique are required to optimally tune the Proportional, Integral, Derivative of the controller for optimal speed control of three phase BLDC motor. Thus, genetic algorithm (GA) based PID controller was used to achieve a high dynamic control performance. The Brushless DC Motor mathematical equation which describes the voltage and corresponding rotational angular speed and torque of the brushless DC motor was employed using electrical DC Machines theorem. The Genetic algorithm was further analyzed by adopting the three common performance indices i.e. Integral Time Absolute Error (ITAE), Integral Square Error (ISE) and Integral Absolute Error (IAE) in order to capture and compare the most suitable BLDC Motor speed and torque control characteristics. All simulations were done using MATLAB (R2018a). The simulation result showed that the system with GA-PID controller had the better system response when compared with the existing technique of ZN-PID controller.