Study of Diebond Machine Platform on Theta Rotation Performance
Edwin M. Graycochea Jr. *
New Product Development and Introduction, Back-End Manufacturing and Technology STMicroelectronics, Inc., Calamba City, Laguna, 4027, Philippines.
Rennier S. Rodriguez
New Product Development and Introduction, Back-End Manufacturing and Technology STMicroelectronics, Inc., Calamba City, Laguna, 4027, Philippines.
Frederick Ray I. Gomez
New Product Development and Introduction, Back-End Manufacturing and Technology STMicroelectronics, Inc., Calamba City, Laguna, 4027, Philippines.
*Author to whom correspondence should be addressed.
Abstract
Theta rotation on die during diebond process is one of the critical machine responses especially for land grid array (LGA) device with tight tolerances requirement. The paper focuses on the die theta rotation tolerance capability with critical design for LGA device evaluated on two different diebond machine platforms. The evaluation was narrowed down into two main diebond machines with the objective of attaining the best performance in terms of die theta rotation tolerance capability. The study used a side-by-side comparison analysis in terms of theta rotation on the two machines and presented the effect of machine selection on the theta rotation response. Theta rotation was monitored and both machines satisfied the specification of 1 degree of maximum rotation, though diebond Machine 1 was able to produce a more stable diebonding with only around less than 0.15 degree of theta rotation variation. For future works, the selected diebond machine could be used for devices with critical requirement.
Keywords: Diebond process, LGA, semiconductor, theta rotation