Epoxy Fillet Height Study of Tapeless QFN Leadframe Package on Different Diebonders
E. Graycochea Jr. *
New Product Development and Introduction, STMicroelectronics, Inc., Calamba City, Laguna, 4027, Philippines.
R. Rodriguez
New Product Development and Introduction, STMicroelectronics, Inc., Calamba City, Laguna, 4027, Philippines.
F. R. Gomez
New Product Development and Introduction, STMicroelectronics, Inc., Calamba City, Laguna, 4027, Philippines.
*Author to whom correspondence should be addressed.
Abstract
The paper focused on the evaluation of quad-flat no-leads (QFN) device in tapeless leadframe technology on different diebonder platforms to achieve an acceptable fillet height performance. The study was narrowed down into two main machines with the objective of attaining a fillet height of less than 75 % for small die. Eventually, the fillet height requirement was achieved by both diebonder platforms, hence, these machines could be used for future works on devices with similar requirement.
Keywords: Diebond process, fillet height, glue, QFN