Comparison of Silicon Die Strength Using Different Loading Anvil Shapes
Jefferson Talledo *
STMicroelectronics, Inc., Calamba City, 4027, Laguna, Philippines.
*Author to whom correspondence should be addressed.
Abstract
Die fracture strength measurement is important to assess the robustness of a specific silicon die such that it is strong enough to resist die crack. There are several methods used to measure the strength of silicon die and 3-point bend test is the most common. However, the impact of the loading anvil shape on die strength results needs to be investigated. This paper discusses the comparison of die strength characterization using different loading anvil shapes in a 3-point bend test. The anvil shapes considered were wedge shape and needle shape. Die strength calculations were all done using the standard 3-point bend formula for flexural stress. Statistical analysis of the results revealed that die strength measured using wedge shape loading anvil is not significantly different from the strength measured using the needle shape loading anvil. Therefore, using the needle shape loading anvil in a 3-point bend test could still provide die strength results comparable with the results using the standard wedge shape loading anvil.
Keywords: Die strength, die fracture strength, die crack, 3-point bend test, loading anvil, wedge shape, needle shape