Mitigating Wire Short Defect on LGA Device through Substrate Design Optimization
J. Pulido
New Product Development & Introduction, STMicroelectronics, Inc., Calamba City, Laguna 4027, Philippines.
R. Rodriguez
New Product Development & Introduction, STMicroelectronics, Inc., Calamba City, Laguna 4027, Philippines.
F. R. Gomez *
New Product Development & Introduction, STMicroelectronics, Inc., Calamba City, Laguna 4027, Philippines.
E. Graycochea Jr.
New Product Development & Introduction, STMicroelectronics, Inc., Calamba City, Laguna 4027, Philippines.
*Author to whom correspondence should be addressed.
Abstract
During new product development of a substrate land grid array (LGA) device, issues were encountered at wirebonding process due to design constraints. This paper is focused on addressing the wire-to-wire short defect during wirebonding process of the first bond. Wirebond process optimization was comprehensively employed, but eventually recommended to have a substrate redesign with relocated bond fingers to increase the wire angle (less steep) between the first bond and the second bond. With the improvement done in the substrate design and through wirebond process optimization, wire-to-wire short defect occurrence was successfully eliminated.
Keywords: Bond finger, LGA, substrate, wire short, wirebond process