Lead Scratch Resolution through Wirebonding Process Optimization on QFN Packages
Jonathan Pulido
New Product Development and Introduction, STMicroelectronics, Inc., Calamba City, Laguna, 4027, Philippines.
Frederick Ray Gomez
New Product Development and Introduction, STMicroelectronics, Inc., Calamba City, Laguna, 4027, Philippines.
Edwin Graycochea Jr. *
New Product Development and Introduction, STMicroelectronics, Inc., Calamba City, Laguna, 4027, Philippines.
*Author to whom correspondence should be addressed.
Abstract
With the continuous trend of new technologies in semiconductor manufacturing assembly, challenges and issues are unavoidable. This paper presents an improvement done in quad-flat no-leads (QFN) leadframe package to resolve the quantity of unit rejection due to leads scratch underneath the leadframe. Moreover, the reject manifestation was captured after wirebonding process. Parameter optimization particularly for the second bond with the combination of bond force and bond scrubbing parameters was done to totally eliminate this type of issue after wirebonding process. With the wirebonding process optimization and improvement done, a reduction of 95 percent of leads scratch occurrence was achieved.
Keywords: QFN, leadframe, wirebonding, bond force, bond scrubbing.