Rubber-tip Design Improvement for Die Crack Elimination at Diebond Process
Rennier S. Rodriguez *
New Product Development and Introduction, STMicroelectronics, Inc., Calamba City, Laguna, 4027, Philippines.
Frederick Ray I. Gomez
New Product Development and Introduction, STMicroelectronics, Inc., Calamba City, Laguna, 4027, Philippines.
*Author to whom correspondence should be addressed.
Abstract
The paper focused on the elimination of die crack occurrence at the diebond process. Design of experiment (DOE) was done on the pick and place rubber-tip design and an improved design was finalized. The improved rubber-tip configuration with smaller vacuum design and full contact surface eventually resolved the die crack issues, improving the manufacturability of thin silicon die during diebond process. For future works, the configuration could be applied for packages with similar requirement.
Keywords: Diebond process, rubber-tip design, semiconductor, assembly.