RSOB Shorting Defect Resolution through Looping Optimization and Ball Placement at Wirebond Process
Journal of Engineering Research and Reports,
Wirebonding process is one of the most challenging assembly manufacturing process in semiconductor packaging industry. This paper discussed the wirebonding challenge and the solution to resolve the wire to die shorting on reverse stitch on ball (RSOB) and prevent irregular looping height for the substrate land grid array (LGA) device. Comprehensive parameter optimization was done particularly on the wirebond looping to ensure that no wire depression and no capillary hitting would occur wirebonding setup. Ultimately, the optimized wirebonding parameter prevented the occurrence of looping issues during the lot process. For future works, the configuration and technique could be applied on packages with similar situation.
- Die reference
- looping profile
- pattern recognition
- wirebonding process
How to Cite
Yeap LL. Meeting the assembly challenges in new semiconductor packaging trend. 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT). Malaysia. 2010;1-5.
Liu Y, et al. Trends of power electronic packaging and modeling. 10th Electronics Packaging Technology Conference. Singapore;2008.
Saha S. Emerging business trends in the semiconductor industry. Proceedings of PICMET '13: Technology Management in the IT-Driven Services (PICMET). USA. 2013;2744-2748.
Tan CE, et al. Challenges of ultimate ultra-fine pitch process with gold wire & copper wire in QFN packages. 36th International Electronics Manufacturing Technology Conference. Malaysia. 2014;1- 5.
Ling J, et al. Wire bond reliability – an overview on the mechanism of formation/growth of intermetallics. Semicon. Singapore. 2008.
Tran TA, et al. Fine pitch probing and wirebonding and reliability of aluminum capped copper bond pads. IEEE 50th Electronic Components and Technology Conference (ECTC). USA. 2000;1674-1680.
Sumagpang Jr. A, et al. Package design improvement for wire shorting resolution. Journal of Engineering Research and Reports. 2020;11(2);41-44.
Descartin M, et al. Non-continuous IMC in copper wirebonding: key factor affecting the reliability. 6th International Conference on Electronic Packaging Technology (ICEPT). China. 2015;403-407.
Angeles A, Arellano IH. Understanding non-stick on lead wirebond failure due to leadfinger surface roughness. International Research Journal of Advanced Engineering and Science. 2019;4(2);49- 54.
Sameoto D, et al. Wirebonding characterization and optimization on thick film su-8 mems structures and actuators. TRANSDUCERS 2007 - 2007 International Solid-State Sensors, Actuators and Microsystems Conference. France. 2007;2055-2058.
Moreno A, et al. Enhanced loop height optimization for complex configuration on QFN device. 22nd IEEE Electronics Packaging Technology Conference (EPTC). Singapore. 2020;182- 184.
Abstract View: 30 times
PDF Download: 15 times