Understanding Package Crack Signatures in a Leadframe Semiconductor Package

Main Article Content

Jefferson Talledo


This paper presents the simulation approach used to understand package crack signatures of a leadframe package under different mechanical loading scenarios. Package crack is one of the common problems with semiconductor packages. A better understanding of the different crack signatures would help identify the root cause quickly and be able to find the correct solution. In this study, a high precision materials testing system was used to apply mechanical loading to the package simulating different scenarios that could produce the crack. Based on the testing results, cracks have distinct signatures depending on how the force is applied. With the different signatures identified, this approach makes it easy to find the root cause of the crack in actual applications or assembly processes and resolve the problem faster.

Package crack, leadframe package, mechanical loading, crack signature, mechanical stress.

Article Details

How to Cite
Talledo, J. (2021). Understanding Package Crack Signatures in a Leadframe Semiconductor Package. Journal of Engineering Research and Reports, 20(3), 6-14. https://doi.org/10.9734/jerr/2021/v20i317274
Original Research Article


Kong R, Tulkoff C, Hillman C. The reliability challenges of QFN packaging. DfR Solutions.

Mangrum M. Enhancing Punch MLF® Packaging with Edge Protection™ Technology. Amkor Technology, Inc; 2020.

Lei WS, Kumar A. Delamination and reliability issues in packaged devices. Adhesion in Microelectronics. Scrivener Publishing LLC; 2014.

Olney AH. Eliminating the top causes of customer-attributable integrated circuit failures. IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits; 2013.

QFN Package Mount Manual. Seiko Epson Corporation; 2018.

Che FX, Pang HLJ, Zhu WH, Sun AYS. Cyclic bend fatigue reliability investigation for Sn-Ag-Cu solder joints. Electronics Packaging Technology Conference; 2006.

Che FX, Pang HLJ. Bend Fatigue Reliability Test and Analysis for Pb-Free Solder Joint. Proceedings of 7th EPTC; 2006.

Pang HLJ and Che FX. Isothermal cyclic bend fatigue test method for lead free solder joints. Inter Society Conference on Thermal Phenomena; 2006.

van Driel WD, van Gils MAJ, Fan X, Zhang GQ, Ernst LJ. Driving mechanisms of delamination related reliability problems in exposed pad packages. IEEE Transactions on Components and Packaging Technologies. 2008; 31:2.

Abdullah S, Ariffin AK, Nizwan CKE, et al. Failure analysis of a semiconductor packaging leadframe using the signal processing approach. International Journal of Modern Physics; 2010.

Yusoff WYW, Jalar A, Othman NK, Rahman IA. Gamma-irradiation effect on material properties behaviour of semiconductor package. American Institute of Physics; 2013.

Qian Q, Liu Y, Irving S, Yang H, Zhang Y. Simulation and analysis for lead frame bending impact to assembly singulation process. ICEPT; 2006.