Main Article Content
Technological change has brought the global market into broad industrialization and modernization. One major application in the semiconductor industry demands safety and high reliability with strict compliance requirement. This technical paper focuses on the package design solution of quad-flat no leads (QFN) to mitigate the leadframe bouncing and its consequent effect of lifted wire and/or non-stick on leads (NSOL) defects on multi-wire ground connection. Multi-wire on single lead ground (or simply Gnd) connection plays critical attribute in the test coverage risk assessment. Cases of missing wire and/or NSOL on the multi-wire Gnd connection cannot be detected at test resulting to Bin1 (good) instead of Bin5 (open) failure. To ease the failure modes mechanism, a new design of QFN leadframe package with lead-to-diepad bridge-type connection was conceptualized for device with extended leads and with multiple Gnd wires connection. The augmented design would provide better stability than the existing leadframe configurations during wirebonding. Ultimately, the design would help eliminate potential escapees at test of lifted Gnd wire not detected.
Tsukada Y, et al. Trend of semiconductor packaging, high density and low cost. Proceedings of the 4th International Symposium on Electronic Materials and Packaging. Taiwan. 2002; 1-6.
Liu Y, et. al. Trends of power electronic packaging and modeling. 10th Electronics Packaging Technology Conference. Singapore. 2008;1-11.
Yeap LL. Meeting the assembly challenges in new semiconductor packaging trend. 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT). Malaysia. 2010;1-5.
Tan CE, et al. Challenges of ultimate ultra-fine pitch process with gold wire & copper wire in qfn packages. 36th International Electronics Manufacturing Technology Conference. Malaysia. 2014; 1-5.
Tran TA, et al. Fine pitch probing and wirebonding and reliability of aluminum capped copper bond pads. IEEE 50th Electronic Components and Technology Conference (ECTC). USA. 2000;1674-1680.
Dresbach C, et al. Local hardening behavior of free air balls and heat affected zones of thermosonic wire bond interconnections. European Microelectronics and Packaging Conference. Italy. 2009;1-8.
Lall P, et al. Reliability of copper, gold, silver, and pcc wirebonds subjected to harsh environment. IEEE 68th Electronic Components and Technology Conference (ECTC). USA. 2018;724-734.
Chen NJ, et al. Quad flat non-leaded semiconductor package and method of fabricating the same. US Patent No. US6703691B2; 2004.
Sumagpang Jr. A, et al. Non-stick on pad defect reduction through clamp and insert design augmentation. Journal of Engineering Research and Reports. 2020;12(2):37-45.
Angeles A, Arellano IH. Understanding non-stick on lead wirebond failure due to leadfinger surface roughness. International Research Journal of Advanced Engineering and Science. 2019;4(2):49-54.
Moreno A, et al. Enhanced loop height optimization for complex configuration on qfn device. 22nd IEEE Electronics Packaging Technology Conference (EPTC). Singapore. 2020;182-184.