Optimization of Dispensing Parameter to Eliminate the Excessive Epoxy Dispense in Die Attach

Main Article Content

Michael D. Capili

Abstract

Excessive epoxy flow on the dispensing nozzle may result in epoxy tailings due to unoptimized dispensing parameters.  This may cause various problems related to epoxy dispensing, such as epoxy splatter, epoxy on lead, and epoxy bridging. This research study is conducted to eliminate the cause of epoxy related defects. Optimization of dispensing parameter using Design of Experiment as a methodology to reduce the excessive epoxy PPM rate. And base on the DOE main effect plot, excessive epoxy dispense PPM reduces as Snuffback time increases or faster.

Keywords:
Die attach, epoxy splatter, excessive epoxy.

Article Details

How to Cite
Capili, M. D. (2021). Optimization of Dispensing Parameter to Eliminate the Excessive Epoxy Dispense in Die Attach. Journal of Engineering Research and Reports, 20(1), 1-5. https://doi.org/10.9734/jerr/2021/v20i117242
Section
Original Research Article

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