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The development of new technology with thinner and smaller packages has become the movement and focus on semiconductor assembly industry. This paper presents an improvement done in dual-flat no-leads (DFN) package to resolve the quantity of rejection due to die attach film (DAF) bleed out on the die paddle of the leadframe. This reject manifestation was seen after die attach process. Parameter optimization particularly for the bonding with the combination of bond force and bond time parameter was done to eliminate this type of issue after die attach process. With this die attach process optimization and improvement done, DAF bleed out occurrence was eliminated with 100% reduction improvement.
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