Pick and Place Process Defect Mitigation on Semiconductor BGA Device

Main Article Content

Antonio R. Sumagpang Jr.
Frederick Ray I. Gomez
Edwin M. Graycochea Jr.


With the new devices and new technologies in semiconductor industry are getting more challenging to process because of new processes and process bricks. One of the most challenging assembly processes is the pick and place or the die attach process. Issues were encountered during product development phase of a semiconductor ball grid array (BGA) device of radio frequency (RF) applications and one of which is the “thrown” dies during die picking. This paper is focused on addressing the thrown dies issue at pick and place process. Installation of blower ionizer on the machine is an extensive improvement done to eliminate the foreign materials resulting to thrown dies during picking. With this improvement, a reduction of around 80 percent of thrown dies was achieved. For future works, the improvement and learnings could be used for devices with similar requirement.

BGA, integrated circuit, pick and place, semiconductor assembly.

Article Details

How to Cite
Jr., A. R. S., Gomez, F. R. I., & Jr., E. M. G. (2020). Pick and Place Process Defect Mitigation on Semiconductor BGA Device. Journal of Engineering Research and Reports, 17(3), 1-5. https://doi.org/10.9734/jerr/2020/v17i317187
Original Research Article


Coombs C, Holden H. Printed circuits handbook. 7th ed., McGraw-Hill Education, USA; 2016.

Harper C. Electronic packaging and interconnection handbook. 4th ed., McGraw-Hill Education, USA; 2004.

Doering R, Nishi Y. Handbook of semiconductor manufacturing technology. 2nd ed., CRC Press, USA; 2007.

May GS, Spanos CJ. Fundamentals of semiconductor manufacturing and process control. 1st ed., Wiley-IEEE Press, USA; 2006.

Geng H. Semiconductor manufacturing handbook. 2nd ed., McGraw-Hill Education, USA; 2017.

Xian TS, Nanthakumar P. Dicing die attach challenges at multi die stack packages. 35th IEEE/CPMT International Electronics Manufacturing Technology Conference. Malaysia: 2012;1-5.

Saha S. Emerging business trends in the semiconductor industry. Proceedings of PICMET '13: Technology Management in the IT-Driven Services (PICMET). USA. 2013;2744-2748.

Sumagpang Jr. A, Gomez FR. A methodical approach in critical processes optimization of new scalable package semiconductor device for ESD applications. Asian Journal of Engineering and Technology. 2018;6(6):78-87.

Yeap LL. Meeting the assembly challenges in new semiconductor packaging trend. 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT). Malaysia. 2010;1-5.

Tsukada Y, et al. Trend of semiconductor packaging, high density and low cost. Proceedings of the 4th International Symposium on Electronic Materials and Packaging. Taiwan. 2002; 1-6.

Graycochea Jr. E, et al. Die attach process analysis of enhanced stand-off stopper on tapeless leadframe. Journal of Engineering Research and Reports. 2020;11(1):22- 26.

Kahler J, et al. Pick-and-place silver sintering die attach of small-area chips. IEEE Transactions on Components, Packaging and Manufacturing Technology. 2012;2(2).

Graycochea Jr. E, et al. Process enhancement to eliminate adhesive film remains during die picking. Journal of Engineering Research and Reports. 2020;11(3):1-4.

Abdullah Z, et al. Die attach capability on ultra thin wafer thickness for power semiconductor. 35th IEEE/CPMT International Electronics Manufacturing Technology Conference. Malaysia. 2012; 1-5.

Gomez FR, Mangaoang T. Elimination of ESD events and optimizing waterjet deflash process for reduction of leakage current failures on QFN-mr leadframe devices. Journal of Electrical Engineering, David Publishing Co. 2018;6(4):238- 243.

ESD Association. Fundamentals of esd, device sensitivity and testing. USA; 2011.