Pick and Place Process Defect Mitigation on Semiconductor BGA Device

Main Article Content

Antonio R. Sumagpang Jr.
Frederick Ray I. Gomez
Edwin M. Graycochea Jr.

Abstract

With the new devices and new technologies in semiconductor industry are getting more challenging to process because of new processes and process bricks. One of the most challenging assembly processes is the pick and place or the die attach process. Issues were encountered during product development phase of a semiconductor ball grid array (BGA) device of radio frequency (RF) applications and one of which is the “thrown” dies during die picking. This paper is focused on addressing the thrown dies issue at pick and place process. Installation of blower ionizer on the machine is an extensive improvement done to eliminate the foreign materials resulting to thrown dies during picking. With this improvement, a reduction of around 80 percent of thrown dies was achieved. For future works, the improvement and learnings could be used for devices with similar requirement.

Keywords:
BGA, integrated circuit, pick and place, semiconductor assembly.

Article Details

How to Cite
Jr., A. R. S., Gomez, F. R. I., & Jr., E. M. G. (2020). Pick and Place Process Defect Mitigation on Semiconductor BGA Device. Journal of Engineering Research and Reports, 17(3), 1-5. https://doi.org/10.9734/jerr/2020/v17i317187
Section
Original Research Article

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