Main Article Content
Process improvement through modification in the design of indirect material is one potential direction to improve the productivity during assembly manufacturing. In this paper, an augmented design of anvil block is presented to reduce the crumpled strips, leadframe bending and dents, uneven bonding of die, localized insufficient epoxy, and misaligned die encountered during the conversion and setup stage. The implementation of the augmented design improves the current assembly practice through eliminating the replacement of anvil block that is the cause of misalignment on the indexer handler of the die attach machine. Through this design, the selection of appropriate vacuum hole setup can be through the sliding insert only without pulling out the anvil block from the machine.
Xian TS, Nanthakumar P. Dicing die attach challenges at multi die stack packages. 35th IEEE/CPMT International Electronics Manufacturing Technology Conference. Malaysia. 2012;1-5.
Sumagpang Jr. A, Rada A. A systematic approach in optimizing critical processes of high density and high complexity new scalable device in MAT29 risk production using state-of-the-art platforms. Presented at the 22nd ASEMEP Technical Symposium, Philippines; 2012.
Liu Y, Irving S, Luk T, Kinzer D. Trends of power electronic packaging and modeling. 10th Electronics Packaging Technology Conference. Singapore. 2008;1-11.
Harper C. Electronic packaging and interconnection handbook. 4th Ed., McGraw-Hill Education, USA; 2004.
May GS, Spanos CJ. Fundamentals of semiconductor manufacturing and process control. 1st Ed., Wiley-IEEE Press, USA; 2006.
Nenni D, McLellan P. Fabless: the transformation of the semiconductor industry. Create Space Independent Publishing Platform, USA; April 2014.
Doering R, Nishi Y. Handbook of semiconductor manufacturing technology. 2nd ed., CRC Press, USA; 2007.
Rodriguez R, Graycochea Jr. E, Seguido R, Gomez FR. Die attach process optimization with enhanced epoxy control on leadframe package. Journal of Engineering Research and Reports. 2020; 14(2);32-37.
Abdullah Z, Vigneswaran L, Ang A, Yuan GZ. Die attach capability on ultra thin wafer thickness for power semiconductor. 35th IEEE/CPMT International Electronics Manufacturing Technology Conference. Malaysia. 2012;1-5.