Addressing Package Voids on Extremely Small Leadframe Device

Main Article Content

A. Sumagpang Jr.
F. R. Gomez

Abstract

The paper focused in addressing the package voids defect of a semiconductor device utilizing an extremely small leadframe technology. Potential risk analysis and pareto diagram were completed to identify the top reject contributors and eventually come-up with the robust solution. A comprehensive design of experiments (DOE) was completed and solution validation was performed to formulate the effective corrective actions. Results revealed that package voids were addressed by optimizing the molding process focusing on the molding temperature and curing time. A significant improvement of 95 % for package voids reduction was achieved. For future works, the parameters and learnings could be used on devices with similar configuration.

Keywords:
Compression molding, leadframe, line-stressing, package voids, semiconductor

Article Details

How to Cite
Jr., A. S., & Gomez, F. R. (2020). Addressing Package Voids on Extremely Small Leadframe Device. Journal of Engineering Research and Reports, 16(4), 1-7. https://doi.org/10.9734/jerr/2020/v16i417172
Section
Original Research Article

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