Resolution of Damaged Metallization on Highly Complex Semiconductor Device
Journal of Engineering Research and Reports,
The paper focused on the resolution of damaged metallization during assembly process that lead to gross open-short (O/S) rejections during functional testing of a highly complex semiconductor package. Numerous batches were put on hold due to not meeting the specification assigned for the short contact test. Design of experiments (DOE) on assembly processes were conducted and eventually identified the reject as an electrostatic discharge (ESD) related failure. Corrective actions and ESD controls significantly reduced the occurrence of damaged metallization with around 85% reduction.
How to Cite
Tsukada Y, Kobayashi K, Nishimura H. Trend of semiconductor packaging, high density and low cost. Proceedings of the 4th International Symposium on Electronic Materials and Packaging. Taiwan. 2002; 1-6.
Liu Y, Irving S, Luk T, Kinzer D. Trends of power electronic packaging and modeling. 10th Electronics Packaging Technology Conference. Singapore. 2008; 1-11.
Saha S. Emerging business trends in the semiconductor industry. Proceedings of PICMET '13: Technology Management in the IT-Driven Services (PICMET). USA. 2013;2744-2748.
Geng H. Semiconductor manufacturing handbook. 2nd Ed., McGraw-Hill Education, USA; 2017.
Coombs C, Holden H. Printed circuits handbook. 7th Ed., McGraw-Hill Education, USA; March, 2016.
Harper C. Electronic packaging and interconnection handbook. 4th Ed., McGraw-Hill Education, USA; 2004.
May GS, Spanos CJ. Fundamentals of semiconductor manufacturing and process control. 1st Ed., Wiley-IEEE Press, USA; 2006.
ESD Association. Fundamentals of esd, device sensitivity and testing. USA; 2011.
Sumagpang Jr. A, Gomez FR. A methodical approach in critical processes optimization of new scalable package semiconductor device for ESD applications. Asian Journal of Engineering and Technology. 2018;6(6):78-87.
Pulido J, Gomez FR, Graycochea Jr. E. Lead scratch resolution through wirebonding process optimization on qfn packages. Journal of Engineering Research and Reports. 2020;15(1):29-33.
Gomez FR, Mangaoang Jr. T. Elimination of esd events and optimizing waterjet deflash process for reduction of leakage current failures on qfn-mr leadframe devices. Journal of Electrical Engineering, David Publishing Co. 2018; 6(4):238-243.
Abstract View: 447 times
PDF Download: 478 times