Implementing Single-Row Process Plate Design for Pre-Encapsulated Lead Frame
Journal of Engineering Research and Reports,
This paper presents the application of an innovative design of wirebond process plate during wirebonding process of thin semiconductor carrier such as the pre-encapsulated leadframe. The implementation of the specialized process plate aims to improve the conventional method of wirebonding from panel type to single-row design to reduce the occurrence of warpage on thin leadframes. In this study, an 85% reduction for warpage level is achieved after the introduction of the new design of process plate. Future works could use the improved process plate design for devices of similar configuration.
- Wirebond process plate
- wirebonding process
How to Cite
Lall P, Deshpande S, Nguyen L. Reliability of copper, gold, silver, and PCC wirebonds subjected to harsh environment. IEEE 68th Electronic Components and Technology Conference, San Diego, California, USA; 2018.
Tsukada Y, Kobayashi K, Nishimura H. Trend of semiconductor packaging, high density and low cost. Proceedings of the 4th International Symposium on Electronic Materials and Packaging. Taiwan. 2002;1-6.
Saha S. Emerging business trends in the semiconductor industry. 2013 Proceedings of PICMET '13: Technology Management in the IT-Driven Services (PICMET), pp. 2744-2748, USA; 2013.
Yeap LL. Meeting the assembly challenges in new semiconductor packaging trend. 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT). Malaysia. 2010;1-5.
Sumagpang Jr. A, Rada A. A systematic approach in optimizing critical processes of high density and high complexity new scalable device in MAT29 risk production using state-of-the- art platforms. Presented at the 22nd ASEMEP Technical Symposium, Philippines; 2012.
Liu Y, Irving S, Luk T, Kinzer D. Trends of power electronic packaging and modeling. 10th Electronics Packaging Technology Conference. Singapore. 2008;1-11.
Harper C. Electronic packaging and interconnection handbook. 4th ed., McGraw-Hill Education, USA; 2004.
May GS, Spanos CJ. Fundamentals of semiconductor manufacturing and process control. 1st Ed., Wiley-IEEE Press, USA; 2006.
Nenni D, McLellan P. Fabless: the transformation of the semiconductor industry. CreateSpace Independent Publishing Platform, USA; 2014.
Rodriguez R, Maming MG, Gomez FR. Package and process design augmentation of QFN leadframe device. Journal of Engineering Research and Reports. 2020;10(2);1-6.
Sumagpang Jr. A, Rodriguez R, Gomez FR. Non-stick on pad defect reduction through clamp and insert design augmentation. Journal of Engineering Research and Reports. 2020;12(2);37-45.
Abstract View: 475 times
PDF Download: 329 times