A Study of Dispense Needle for Die Attach Voids Mitigation

Main Article Content

R. Rodriguez
B. C. Bacquian
F. R. Gomez
E. Graycochea Jr.

Abstract

The need of data storage devices and new technologies continues to grow with more robust and stable functioning capability. With that, improvement and utilization never stop for a seamless output. One device that is currently on new product introduction is a quad-flat no-leads (QFN) utilizing a tapeless leadframe technology. The new device used highly conductive glue with metal spacer and has experienced gross glue voids defect parts per million (ppm). Glue voids were measured for cumulative voids criteria, with values higher compared to the specification. The study used analysis of variance (ANOVA) on the dispense needle diameter and revealed the effect levels of needle diameter on cumulative voids reduction. For subsequent works, the configuration could be applied for packages with similar requirement.

Keywords:
Die attach process, QFN, dispense needle, glue voids.

Article Details

How to Cite
Rodriguez, R., Bacquian, B. C., Gomez, F. R., & Jr., E. G. (2020). A Study of Dispense Needle for Die Attach Voids Mitigation. Journal of Engineering Research and Reports, 14(1), 25-29. https://doi.org/10.9734/jerr/2020/v14i117114
Section
Original Research Article

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