Semiconductor QFN Package with Advanced Interlocking Design

Main Article Content

Rennier Rodriguez
Frederick Ray Gomez


The mechanical interlocking structure for quad-flat no-lead (QFN) assembly for densified leadframe degrades as the package becomes thinner. Detractors such as package reliability and design requirement hinder further qualification of leadframes with increased number of input/output (I/O) pins. In this paper, a new and advanced design of leadframe is discussed and presented with improvement in mechanical interlocking structure of high stress areas such as lead and pad junction. The leadframe is re-designed having lead lines on the lead and pad that will be etched away after molding process replacing full copper base frame. Through application of the design, the effective mechanical interlocking is improved from 60% to 100% for mold-lead and mold-pad interface.

Quad-flat no-lead, mechanical interlock, leadframe design

Article Details

How to Cite
Rodriguez, R., & Gomez, F. R. (2020). Semiconductor QFN Package with Advanced Interlocking Design. Journal of Engineering Research and Reports, 12(1), 1-6.
Original Research Article


Liu Y, Irving S, Luk T, Kinzer D. Trends of power electronic packaging and modeling. 10th Electronics Packaging Technology Conference, Singapore; 2008.

Geng H. Semiconductor manufacturing handbook. 2nd Ed., McGraw-Hill Education, USA; 2017.

STMicroelectronics. Assembly and EWS design rules for wire bond interconnect dice. rev. 53.0; 2018.

Krishnan P, Leong YK, Rafzanjani F, Batumalay N. Die attach film (DAF) for breakthrough in manufacturing (BIM) application. 36th International Electronics Manufacturing Technology Conference, Malaysia; 2014.

Coombs C, Holden H. Printed circuits handbook. 7th Ed., McGraw-Hill Education, USA; 2016.

STMicroelectronics. Procurement and quality general specification for metallic leadframe. rev. 8.0; 2019.

May GS, Spanos CJ. Fundamentals of semiconductor manufacturing and process control. 1st Ed., Wiley-IEEE Press, USA; 2006.

Nenni D, McLellan P. Fabless: The transformation of the semiconductor industry. CreateSpace Independent Publishing Platform, USA; 2014.

Rodriguez R, Gomez FR. Incorporating package grinding process for QFN thin device manufacturing. Journal of Engineering Research and Reports. 2020;9(2):1-6.

Sumagpang A, Gomez FR. A methodical approach in critical processes optimization of new scalable package semiconductor device for ESD applications. Asian Journal of Engineering and Technology. 2018;6(6): 78-87.

Rodriguez R, Gomez FR. Pick and place process optimization for thin semiconductor packages. Journal of Engineering Research and Reports. 2019;4(2):1-9.

Gomez FR, Mangaoang T. Elimination of ESD events and optimizing waterjet deflash process for reduction of leakage current failures on QFN-MR leadframe devices. Journal of Electrical Engineering, David Publishing Co. 2018;6(4):238-243.