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Wirebonding process is one important assembly process responsible for providing electrical connections between the silicon die and the external leads of a semiconductor package or device. The process also brings along some challenges as the device becomes more complex and critical. This paper is focused on the prevention of the broken wire on neck during wirebonding process of an advanced semiconductor package with multi-die configuration. Extensive wire loop character-ization and optimization was done and a specialized wirebonding configuration solution was formulated. Ultimately, the solution prevented high loop and wire sagging that could touch or short-circuit the silicon die. For future works, the configuration could be applied on packages with comparable construction.
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