Specialized Wirebond Process Configuration on Advanced Multi-Die Package

Main Article Content

Anthony R. Moreno
Edwin M. Graycochea Jr.
Frederick Ray I. Gomez

Abstract

Wirebonding process is one important assembly process responsible for providing electrical connections between the silicon die and the external leads of a semiconductor package or device. The process also brings along some challenges as the device becomes more complex and critical.  This paper is focused on the prevention of the broken wire on neck during wirebonding process of an advanced semiconductor package with multi-die configuration. Extensive wire loop character-ization and optimization was done and a specialized wirebonding configuration solution was formulated. Ultimately, the solution prevented high loop and wire sagging that could touch or short-circuit the silicon die. For future works, the configuration could be applied on packages with comparable construction.

Keywords:
Wirebond, assembly, semiconductor, multi-die configuration, stacked dice.

Article Details

How to Cite
Moreno, A. R., Graycochea Jr., E. M., & Gomez, F. R. I. (2020). Specialized Wirebond Process Configuration on Advanced Multi-Die Package. Journal of Engineering Research and Reports, 12(4), 1-5. https://doi.org/10.9734/jerr/2020/v12i417084
Section
Original Research Article

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